Today, at Mobile World Congress Shanghai 2017, Qualcomm has introduced its latest lower-mid-range SoC for the smartphone market – the Snapdragon 450 chipset. The new SoC brings a number of improvements over its predecessor including an upgraded GPU, better camera performance, as well as faster modem. So in this post, let’s take over all look at the new Qualcomm processor.
The new Qualcomm chipset comes with a new upgraded GPU with the Adreno 506, which is claimed to be 25 percent faster graphics rendering over the Adreno 505 GPU on Snapdragon 435.
The Snapdragon 450 also brings the visible improvements in terms of the camera. The new chipset will supports the real-time Bokeh effects and the Qualcomm Hexagon DSP addition, which can improve camera and sensor processing but still using low power. The Snapdragon 450 also supports a single camera up to 21MP like its predecessor. However, it can still handle 13MP + 13MP sensors while using a dual camera setup, a big jump over the 8MP + 8MP support on the Snapdragon 435. Finally, an improvement of the video also comes in the new chipset. The Snapdragon 450 allows capturing and playbacking video at 1080p60, an upgrade from 1080p30 on the Snapdragon 435.
The Quick Charge 3.0 is supported on the new chipset as well that can charge a device from 0 to 80% in just 35 minutes. The USB 3.0 standard is also brought into this new chipset, which should dramatically speed up in transferring data compared to Snapdragon 435 devices.
In terms of connectivity, although the Snapdragon 450 will run on the same X9 LTE modem as its predecessor, it can enable the much faster upload speeds. The Snapdragon 450 SoC also supports LTE Cat 7 and Cat 13 the maximum download speeds up to 300 Mbps and 150 Mbps for upload speeds.
The new Qualcomm chipset will start the mass production in Q3 of this year, and is expected to be integrated on devices by the end of 2017.